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Micross at IMAPS 2019 Boston, MA

Orlando, Florida, September 26, 2019 — Micross is excited to once again exhibit at IMAPS 52nd International Symposium on Microelectronics, October 1-2, 2019, in Boston.

The International Microelectronics Assembly & Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.

Micross will showcase its hi-reliability microelectronic capabilities inclusive of:

  • Bare Die & Wafer Processing
    Broadest Access to Bare Die 30+ Manufacturers
  • Advanced Interconnect Technologies
    Wafer Bumping / Wafer-Level Packaging / 3D Integration
  • Packaging & Assembly
    Optoelectronic & Silicon Photonics Assembly / FlipChip / MCM / SiP
  • Component Modification
    BGA Reballing / Lead Attach / Column Grid Array (CGA)
  • Advanced Testing Services: Electrical & Environmental Test
    FPGA, ASIC, RF Test / Life Test & Burn-in / PEMs-COTS Screening & Qualification
  • Hi-Rel Products
    SMD/5962 & Hi-Rel Memory, Analog & Power

We look forward to speaking with you about your specific packaging needs and to answering any questions you may have about our broad range of products & services.

For additional information about Micross or to request a quote, please visit our website at: or email:

 In business for 40+ years, Micross has remained committed to delivering a complete range of Hi-reliability microelectronic components and services to Aerospace & Defense, Space, Industrial and Commercial customers to support mission-critical requirements. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.