Orlando, Florida, September 26, 2019 — Micross is excited to once again exhibit at IMAPS 52nd International Symposium on Microelectronics, October 1-2, 2019, in Boston.
The International Microelectronics Assembly & Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.
Micross will showcase its hi-reliability microelectronic capabilities inclusive of:
- Bare Die & Wafer Processing
Broadest Access to Bare Die 30+ Manufacturers
- Advanced Interconnect Technologies
Wafer Bumping / Wafer-Level Packaging / 3D Integration
- Packaging & Assembly
Optoelectronic & Silicon Photonics Assembly / FlipChip / MCM / SiP
- Component Modification
BGA Reballing / Lead Attach / Column Grid Array (CGA)
- Advanced Testing Services: Electrical & Environmental Test
FPGA, ASIC, RF Test / Life Test & Burn-in / PEMs-COTS Screening & Qualification
- Hi-Rel Products
SMD/5962 & Hi-Rel Memory, Analog & Power
We look forward to speaking with you about your specific packaging needs and to answering any questions you may have about our broad range of products & services.
In business for 40+ years, Micross has remained committed to delivering a complete range of Hi-reliability microelectronic components and services to Aerospace & Defense, Space, Industrial and Commercial customers to support mission-critical requirements. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.