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Micross Acquires RTI International’s Microsystem Integration and Packaging (MIP) Group

ORLANDO, Florida, October 5, 2016 – Micross Components, Inc. (“Micross”) headquartered in Orlando, Florida is pleased to announce the strategic acquisition of RTI International’s Microsystem Integration and Packaging (“MIP”) Group, one of the premier wafer bumping and wafer level packaging research and fabrication facilities in the United States, servicing commercial and government clients, situated in Research Triangle Park, North Carolina.

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