ISSI is a technology leader that designs, develops and markets high performance integrated circuits; high speed & low power SRAM; low & medium density DRAM and also designs and markets NOR Flash products.

Micross working together with Integrated Silicon Solution, Inc. offers bare die for Multi-Chip Module and hybrid circuit applications as well as memory technologies driven by demands for lower power, higher density, faster speeds and lower cost for volume programs.

  • Long-Term Commitment to SRAM
  • Possible temp ranges available are -40°C to +85°C, -40°C to +105°C, and -40°C to +125°C
  • Manufactures products that meet the highest standards for reliability and performance
  • Micross & ISSI collaborate to offer an extensive range of capabilities to support the Consumer, Industrial, Medical and Aerospace & Defense markets

Featured

KGD and Wafer Solutions

High Speed and Low Power Die & Wafer Products

Features:

  • Low to medium density SDRAM’s: 16Mb-512Mb, SDR, DDR and DDR2
  • Broadest portfolio of SRAM’s and PSRAM’s in the industry
  • Long product life – 7 to 10 years
  • KGD test flow includes Wafer Level Burn In & Speed-Sort


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With 35+ years bare die supply expertise, Micross is proud to be a product support partner for ISSI and to be the leading global one-source, one-solution provider delivering a comprehensive array of capabilities to meet our customer’s individual requirements.

Additional Micross Solutions: