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IMAPS 16th International Conference and Exhibition on Device Packaging

Visit Micross @ Booth 1,

March 3-4, 2020

WekoPa Resort in Fountain Hills, Arizona

IMAPS DPC 2020 Device Packaging Conference Overview:

The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.