Wafer Test

Micross has extensive experience and in-house expertise to design test programs and perform the wafer testing and sorting using our state-of-the-art Accretech 8” and 12” wafer probers. We design vertical probe cards and develop programs for a wide range of circuits, including RF devices running as fast as 6 GHz and high-speed digital ICs with clock speeds as high as 10 GB/sec. Key features of Micross wafer test and sort services include thermal control, multi-site probing, bake retention, bumped wafer probing, in-line or off-line inking, auto alignment and probe mark and wafer ID inspection.

Micross Advantages

  • More than four decades of experience serving Aerospace, Defense, Space and Industrial markets
  • 300 mm (12 inch) and 200 mm (8 inch) capabilities
  • Expertise in test program development
  • RF speeds up to 6 GHz
  • High-speed digital ICs up to 10 GB/sec
  • Active DUT temperature regulation
  • High precision and operational excellence
  • Automatic loader helps minimize contamination

Typical Applications

  • MOSFETs and JFETs
  • IGBTs
  • Diodes
  • Discrete analog devices

Wafer

Equipment

Test Handlers
  • Epson NS-8040 IC Handler (2)
  • Synax SC3100 quad site test handlers (2)
  • Synax SC1211 dual site test handlers (2)
Wafer Probers
  • Accretech UF3000EX
  • Accretech UF200