Turnkey Device Characterization

Micross provides a comprehensive array of complete Turnkey Test & Device Characterization solutions inclusive of the following capabilities:

Test Program Development

  • Multiple platform expertise

Characterization

  • High-speed yield optimization

Wafer Sort/Wafer Probe

  • Up to 300mm wafer probe

Production Test

  • Full IC package testing and hybrid testing. Wafer-level testing. High-speed, multi-site delivery

Program Conversion

  • Technology migration to improve cost effectiveness

Micross’ in-house technically-advanced engineering team can support all technologies, including RF, digital, linear, analog mixed signal and memory.

 
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