Anyone who designs high-reliability electronics for aerospace, military, and space applications has an initial decision of whether their desired design can be achieved with standard COTS (commercial-off-the-shelf) microelectronics, or if a more SWaP optimized solution is needed, designing from the semiconductor bare die level would be required. In this webinar, Semiconductor Die & Wafer manufacturing experts, from leading OEMs, Distribution, and Back-End Semiconductor Value-Added Service providers, demystify the required processing and procurement of semiconductor die, and provide clear actionable guidance to navigate and mitigate potential risks in procuring bare die processed to your required specifications for high-rel aerospace, military, and space applications.
Recorded: June 20th, 2023
Date: Tuesday, June 20, 2023
Time: 11:00 AM ET
Duration: 1 Hour
REGISTER NOWSummary
There are many advantages with utilizing semiconductor bare die in the design of high reliability electronic components, including the ability to maximize SWaP (size, weight, & power) optimization. However, procurement of the semiconductor die needed is not as straightforward as the procurement of of-the-shelf packaged components. For those that have a need to procure semiconductor die, while the benefits to your product design will be great, the steps and processing required can be daunting.
In this webinar, Semiconductor Die & Wafer manufacturing experts, from leading Original Device Manufacturers, OEMs, Distribution, and Back-End Semiconductor Value-Added Service providers, demystify semiconductor die procurement, and provide clear actionable guidance to navigate and mitigate potential risks in procuring bare die processed to your required specifications.
Joseph Celania | Product Line Manager, Micross Die & Wafer Solutions | Micross
For 33 years Joe Celania worked in the semiconductor industry as a business leader with extensive experience in developing people and visiting customers around the world. Joe’s career has been in a variety of roles at Texas Instruments including business development, marketing, program management, and quality. Over the last 10 years, Joe has been focused on high reliability products for aerospace and defense and harsh environment industrial applications. He was also responsible for TI’s wafer and die products where he worked closely with Micross. Most recently, Joe retired from TI’s analog foundry group last fall and early in 2023, took on a role with Micross as product line manager/business development for die and wafer products. Joe is based out of Dallas, Texas.
Britney Wolfe | Director of Operations, Micross Die & Wafer Solutions | Micross
Britney has been with Micross for more than 24 years, starting early on when it was formerly known as Chip Supply. During her time at Micross, she has held roles in sales, supply chain, marketing, and is currently the Director of Operations for Micross’ flagship facility in Apopka, FL. With deep knowledge and experience in all aspects of wafer and die processing and testing, and the obstacles that may be encountered when specifying die, Britney offers highly valued insight for engineering and procurement professionals requiring semiconductor die for their program. Britney is based in Apopka, FL.