Robotic Hot Solder Dipping & Solder Exchange

Solder Exchange Technology is a robotic, automated solder-dipping process to increase component reliability and mitigate tin-whisker formation.

  • Pb-Free (RoHS) ↔ Sn/Pb Solder
  • Post-Process Testing: Solderability, XRF Solder Characterization, Ionic Cleanliness
  • Automated processes for small parts (Chip Cap, SOT, etc.)
  • Proprietary ultra-flat finish for bottom termination packages (QFN, MLF, LCC)

The GEIA-STD-0006 Compliant Process includes:
  • Robotic-controlled six-axis dipping
  • Solder dipping under a nitrogen blanket
  • Solder-level sensing for accurate solder dipping
  • Integral component wash and dry facility
  • Preheating of components to negate thermal shock
  • Lead tinning/solder dip
  • Terminal finish conversion

Robotic dipping

In addition, Micross can also provide in-house solderability testing and X-ray Fluorescence (XRF) scanning services to identify component-finish types.