Robotic Hot Solder Dipping & Solder Exchange
Solder Exchange Technology is a robotic, automated solder-dipping process to increase component reliability and mitigate tin-whisker formation.
- Pb-Free (RoHS) ↔ Sn/Pb Solder
- Post-Process Testing: Solderability, XRF Solder Characterization, Ionic Cleanliness
- Automated processes for small parts (Chip Cap, SOT, etc.)
- Proprietary ultra-flat finish for bottom termination packages (QFN, MLF, LCC)
The GEIA-STD-0006 Compliant Process includes:
- Robotic-controlled six-axis dipping
- Solder dipping under a nitrogen blanket
- Solder-level sensing for accurate solder dipping
- Integral component wash and dry facility
- Preheating of components to negate thermal shock
- Lead tinning/solder dip
- Terminal finish conversion
In addition, Micross can also provide in-house solderability testing and X-ray Fluorescence (XRF) scanning services to identify component-finish types.