Hi-Rel Lead Attach/Replacement

We offer a range of lead attachment services based on our proprietary process, developed to maintain the integrity of component-to-PCB solder joints under stress. Poor compliance, extreme vibration and thermal expansion can cause these joints to crack. We use high-compliance leads that protect the solder interface by allowing the component to flex.

Options include:

  • Thermocompression weld for leadless chip carriers with gold plated finish
  • Tin-Lead (5/95) solder for pre-tinned leadless chip carriers

Lead Replacement

Micross can also replace and reform gold-plated or pre-tinned leads to:

  • Change the footprint of an existing device to gain real estate or extra compliance
  • Recover a device where the leads have been trimmed too short
  • Modify leadless packages

Lead Attachment Services

Our timely and cost-effective lead attach services have been used to successfully replace and reform leads on components for high reliability applications including helicopters, missiles and satellites.

High Temperature Solder Lead Attachment Process

For pre-tinned LCCs 0.350 inches square or larger

During the past several decades, we have attached leads to hundreds of thousands of devices using our post-assembly high-temperature lead-attachment process, with virtually no performance problems with components after board-mounting.

For tin-lead soldering, we use high-liquid-temperature 5Sn-95Pb solder alloy to prevent solder reflow of leaded packages as they undergo further processing.

This method of lead attachment often exceeds the stringent lead-integrity requirements of MIL-STD-883, without impacting the electrical characteristics of the packaged device.

General Specifications

All of our copper post-attached round-lead chip carriers meet the requirements of the following MIL-STD-883 Group D (package related, all classes) Method 5005 subgroups:

  • Physical dimensions
  • Lead integrity
  • Thermal shock
  • Mechanical shock

Lead Material: Copper, CDA 102, ASTM B-170 grade 2 Resistivity Max. 1532 Vg/m2 @ 20°C, Thermal conductivity 226 Btu/Ft•Hr•°F

Finish: Hot solder dip IAW MIL-M-38510 (63/37)

JEDEC M0-110

  • Round-lead J-form chip carriers mounts directly to PWB footprint
  • Meets requirements of MIL-M-38510 and MIL-STD-883
  • JEDEC MO-110 Spec Sheet

JEDEC M0-110 diagram

JEDEC M0-111

Our round-lead gullwing chip carriers meet MIL-M-38510 and MIL-STD-883 requirements, while providing the compliance between the ceramic chip carrier and the printed wiring board.

JEDEC M0-111 diagram

SUPER COMPLIANT Spider J

  • Round-lead 'Spider J' form chip carriers
  • Most compliant 'J' lead available anywhere
  • Meets requirements of MIL-M-38510 and MIL-STD-883
  • Applicable to packages .450" x .550" or larger with fully castellated sides
  • Spider J Spec Sheet

SUPER COMPLIANT Spider J diagram

SUPER COMPLIANT Spider Gullwing

  • Round-lead 'Spider Gullwing' form chip carriers
  • Most compliant 'Gullwing' lead available anywhere
  • Meets requirements of MIL-M-38510 and MIL-STD-883
  • Applicable to packages .450" x .550" or larger with fully castellated sides
  • Spider Gullwing Spec Sheet

SUPER COMPLIANT Spider Gullwing diagram

Thru-Hole Mountable

Thru-Hole Mountable diagram