Micross provides a variety of Column Attach Services following identical processes, materials and workmanship standards as customers have been accustomed to historically from IBM.
- 10/90 Sn/Pb Columns
- Column Attach w/ Palladium Paste
- Precision Coplanarity & Pitch
- Post Column Attach Electrical Test (-55°C to +125°C)
- Application Speciﬁc Burn-In
- Complete Turnkey Solution (Column Attach & Test)
The sheer design and craftsmanship of the patented column attach process by Micross guarantees a superior hi-reliability interconnect and best suited for assembly & component attached integrity. Micross’ highly technical development team coupled with comprehensive electrical and thermal characterization capabilities, allow for seamless turnkey assembly and custom, build-to-suit packaging.