Conversion to leaded spheres for Hi-Rel applications

Micross has developed a proven process for reballing Ball Grid Array (BGA) components to restore them to their original specifications or to bring them up to standards for use in hi-rel applications.

  • Low-cost, quick-turn low & high-volume processing
  • Single reflow reballing minimizes heat exposure
  • Turnkey product purchasing
  • Processing of ceramic and plastic BGAs and LGAs
  • Ball pitch from 0.40mm
  • Pb-free ↔ Sn/Pb balls
Before & after reballing
Before & after reballing

Low & High Volume Processes

Micross' low-volume process eliminates the need for custom tooling and preforms. Our high-volume process utilizes custom tooling for lower piece-part cost.

Deball

Our proprietary automated wave solder deball process completely removes the original solder sphere and pad finish. For an ultra-controlled, non-contact deball process, our exclusive Micross Robotic Hot Solder Dip equipment can also be used.

Robotic Deballing
Robotic Deballing

Electrical Testing

Basic static electrical testing is available post-process to ensure there are no internal component issues or gross/latent ESD damage. Tests include detection of I/O diode opens/shorts and confirmation that Power and GND consumption are within limits.

Automatic Inspection
Automatic Inspection
XRF
XRF

Inventory Management

Fully automated in house EDI, inventory management system with procurement and consignment capabilities.

Facilities

  • ISO9001 and AS9100 registered
  • ESD-safe environment compliant to JESD625B
  • Temperature and humidity controls

Downloads

BGA Reballing