BGA /Ball Attach Services

Micross has developed a proven process for reballing Ball Grid Array (BGA) components to restore them to their original specifications or to bring them up to standards for use in hi-rel applications.

  • Low-cost, quick-turn low & high-volume processing
  • Single reflow reballing minimizes heat exposure
  • Turnkey product purchasing
  • Processing of ceramic and plastic BGAs and LGAs
  • Conversion to leaded spheres for Hi-Rel Applications
  • Ball pitch from 0.40mm
  • Pb-free ↔ Sn/Pb balls
Before & after reballing
Before & after reballing

Low & High Volume Processes

Micross' low-volume process eliminates the need for custom tooling and preforms. Our high-volume process utilizes custom tooling for lower piece-part cost.

Deball

Our proprietary automated wave solder deball process completely removes the original solder sphere and pad finish. For an ultra-controlled, non-contact deball process, our exclusive Micross Robotic Hot Solder Dip equipment can also be used.

Robotic Deballing
Robotic Deballing

Electrical Testing

Basic static electrical testing is available post-process to ensure there are no internal component issues or gross/latent ESD damage. Tests include: detection of I/O diode opens/shorts and confirmation that Power and GND consumption are within limits.

Automatic Inspection
Automatic Inspection
XRF
XRF

Inventory Management

Fully automated in-house EDI, inventory management system with procurement and consignment capabilities.

Facilities

  • ISO9001 and AS9100 registered
  • ESD-safe environment compliant to JESD625B
  • Temperature and humidity controls

Downloads

BGA Reballing