PCB rework and X-Ray inspection
Micross' special rework and repair service is dedicated to providing a quality service to recognized IPC standards. We offer automated removal and replacement of BGA, Micro BGA, and flip-chip plus majority of fine-pitch components. Our specialist rework service is enhanced by our in-house capability to x-ray inspect a variety of electronic components.
X-RAY Inspection of PCB Assembly
X-Ray inspection includes components such as BGA CSP encapsulated devices.
Investment in state-of-the-art technology ensures control, repeatability and quality of repair.
Also available for lead-free initiatives:
- X-ray fluorescence testing for Pb-free components
- X-ray fluorescence testing and verification for compliance to EU directives, RoHS, WEEE and EVL
- Screening for concentrations of Pb in products above specified limits