Micross together with Corfin make repairs that few in the industry are willing to attempt. We’ll perform trace modification in the most inaccessible areas, including under BGAs or other sensitive components.
We repair defective boards and prototypes, correcting manufacturing faults of all kinds: damaged traces and solder mask, incorrectly installed components, manufacturing defects — whatever electrical or mechanical flaws keep your PCB from functioning optimally. In a single manufacturing run, several different boards may present several different types of faults; we’ll analyze each mechanical problem, propose appropriate solutions and repair each one the right way.
We repair and restore pad sites for any component, including fine-pitch and variable-pitch BGAs, QFNs, and package-on-package stacks. We also offer automated removal and replacement of BGA, Micro BGA, and flip-chip plus majority of fine-pitch components. Our in-house technicians routinely rework the most intricate PCB designs, saving even heavily damaged boards. Our specialist rework service is enhanced by our in-house capability to x-ray inspect a variety of electronic components
Multiple rework stations allow our technicians to process a large number of boards in the smallest timeframe, maintaining our exemplary on-time delivery statistics. We analyze manufacturing flaws and find the most cost-effective methods to repair them.