One Source One Solution
  • Support
      • Field Support / Contacts
      • Product Catalog
      • Literature
      • Data Sheets
      • Requests
        • Request a Quote
        • Request Info
        • Tech Support
    • Close
  • About Us
      • Company Overview
      • Markets
      • Facilities & Locations
      • Operations & Quality
      • Supply Chain
      • Management Team
      • News & Info
        • Press Releases
        • Tradeshows
        • Webinars
        • Awards
        • Newsletter
    • Close
  • Careers
Micross
  • Die & Wafer Solutions
      • Die Distribution
        • Line Cards
        • Product Selector Tool
      • Die Express Quick Turn Services
      • EOL Die Sustainment Program (EDSP)
      • Wafer Processing
      • Value Added Services
        • Packaging Solutions
        • Design Support
        • Marking & Labeling / Kitting
        • 3D & Heterogeneous Integration
        • Flip Chip & MCM
        • Novel Microfabrication
        • Wafer Bumping
        • Wafer Test
        • EOL/DMS Sustainment
    • Close
  • Component Modification
      • Component Solutions
        • BGA Reballing
        • Robotic Hot Solder Dip
        • Lead Attach / Component Preparation
        • CGA Attach
        • Trim & Form and Reconditioning
      • PCB Solutions
        • Assembly
        • Rework
        • Repair
        • Component Harvesting
      • Support Solutions
        • Tape & Reel
        • 3D Scanning
        • Bake and Package
        • Marking & Labeling / Kitting
      • Value Added Services
        • Component Qualification
        • Fine & Gross Leak Test
        • Acoustic Microscopy (AM)
        • X-ray Inspection
        • X-ray Fluorescence Analysis (XRF)
        • Device Characterization
        • PEM-Quals
        • ESD Characterization
        • EOL/DMS Sustainment
        • Supplier Managed Inventory
    • Close
  • Hi-Rel Products
      • Hi-Rel Components
        • SMD/5962
        • Memory
        • Optocouplers
        • Power Devices
        • GaN Power Devices
        • Logic Functions
        • Level Translators
        • Transceivers
        • COTS/Retail+
        • Analog
        • High Temp
        • Passives
      • Hi-Rel Diodes
        • Rectifier Diodes
        • TVS Diodes
        • Zener Diodes
        • High Current Rectifier Assemblies
        • High Voltage Rectifier Assemblies
        • Single Phase Full Wave Bridge Assemblies
        • Three Phase Full Wave Bridge Assemblies
        • Center Tap and Doubler Assemblies
        • TVS Assemblies
        • Commercial Off-The-Shelf Diodes
      • Data Bus Products
      • Hi-Rel RF Solutions
      • Packaging & Assembly
        • Hermetic Packaging
        • CSP/Plastic Packaging
        • Custom Packaging
        • Multi-Chip Modules
        • Assembly Services
        • Final Test
      • Value Added Services
        • Component Modification
        • Counterfeit Mitigation
        • Environmental Testing
        • Electrical Testing
        • Wafer Bumping
        • EOL/DMS Sustainment
    • Close
  • Advanced Services
      • Advanced Interconnect
        • Wafer Bumping
        • 3D & Heterogeneous Integration
        • Flip Chip & MCM
        • Novel Microfabrication
      • Electrical Testing
        • Device Characterization
        • RF
        • High-Speed Digital
        • Wafer Test
        • PEM-Quals
        • Qualified Encapsulated Devices (QEDs)
        • Tester Rental
      • Environmental Testing
        • Component Qualification
        • Board Level Qualification
        • ESD Characterization
      • Counterfeit Mitigation
      • Component Inspection
        • Acoustic Microscopy (AM)
        • X-ray Inspection
        • X-ray Fluorescence Analysis (XRF)
        • Fine & Gross Leak Test
      • Reliability Testing
        • Burn In
        • Mechanical
    • Close
  • EOL/DMS Sustainment
      • Original Qualified Product
        • EOL Die Sustainment Program (EDSP)
        • Product Reconditioning
        • Component Harvesting
        • Counterfeit Mitigation
      • Form-Fit-Function Recreation
        • Equivalent Die Characterization & Sourcing
        • Product Recreation
        • COTS Up-screening
      • Program Sustainment Management
        • BOM Monitoring, Reporting & Management
        • Long Term Die & Wafer Storage
        • Supplier Managed Inventory
    • Close

Category: Press Releases [2023]

MicrossAbout UsNews & InfoPress Releases [2023]
By Micross / Press Releases [2023] • All Press Releases / 0 Comments
10 Jan

Micross to Acquire High-Reliability DC-DC Converter Business of Infineon Technologies AG

Acquisition Expands Micross’ High-Rel Power Management Solution Capabilities

By Micross / Press Releases [2023] • All Press Releases / 0 Comments
4 Jan

Micross Acquires KCB Solutions, Adding RF and Microwave Switches, Attenuators, Amplifiers, Multi-chip and Functional Modules to Product Portfolio

Micross Acquires KCB Solutions

Categories

  • Press Releases [2023]
  • Press Releases [2022]
  • Press Releases [2021]
  • Press Releases [2020]
  • Press Releases [Archived]
  • All Press Releases
  • Tradeshows
  • Webinars
  • Articles
  • Newsletters
Micross - One Source. One Solution.

Locations & Contact Info
Website Feedback:
webmaster@micross.com
TwitterLinkedInYouTube

  • Die & Wafer Solutions
  • Component Modification
  • Hi-Rel Products
  • Advanced Services
  • DMS/Sustainment
  • Support
  • About Us
  • Careers
  • Terms & Conditions
  • Shipping Methods
  • Privacy Statement
  • Sitemap
Our Mission:

To support customers’ system-critical requirements through delivering hi-reliability microelectronic components & services on-time and to specification.

SUBSCRIBE TO OUR NEWSLETTER
© 2023 Micross - All rights reserved worldwide. Website and services by LUXSON ltd © 2023 - all rights reserved.