- Products & Services
- +Hi-Rel ICs & Components
- DLA/DSCC Certified Products
- QML/SMD 5962
- Function
- Memory
- +Hi-Rel ICs & Components
- Optocouplers
- GaN Power Devices
- Logic Devices
- Analog
- High Temp
- Passives
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Micross offers the most complete turnkey solution for PEMs and COTS devices based on NASA instructions (PEM-INST 001) as well as any customer-provided screening requirements.
We bring 40+ years expertise in device upscreening and qualifications; in-house assembly, component modification and electrical & reliability test methods to our PEMs / COTS solutions.
Advantages:
The usage of COTS PEMs offers many benefits to overcome the challenges of sourcing hi-reliability or custom component solutions. Micross can perform PEMs / COTS Quals on almost all component technologies including:
- FPGAs, Processors, SoC, ASICs, RF and Memory
- Analog and Mixed Signal Devices
- Digital and logic devices
- Discrete Semiconductor and passives plus many others
Ancillary Services to PEM / COTS Screening and Qualification:
- Component Modification: HSD, BGA Reballing
- Alternative paths for failing PEMs
- Bare Die and Wafer Procurement
- Plastic and Hermetic Assembly
- DPA*
*Micross has partnered with Hi-Rel Labs, the premier authority & industry leader in Destructive Physical Analysis (DPA) and Failure Analysis (FA) to provide customers with one complete PEM-Qual solution.