Uses sound waves to non-destructively view the inside of molded packages, AM can detect delamination outside the limits of J-STD-020 to ensure a long service life free of internal corrosion.
X-ray technology is one of the best possible ways to find faults of all kinds: poor wetting and insufficient reflow, joint density, ball irregularities, bridges between solder balls, voiding, shorts, and so on. Our X-ray inspection can be automated, enabling us to set inspection parameters and process a large volume of PCBs quickly.
Determines the percentage and thickness of Lead (Pb) and other elements in termination finishes.
Using the latest X-ray fluorescence (XRF) scanning equipment, we can perform a wide range of tests on electronic components and fabrication materials to screen for restricted substances (e.g. lead, mercury, cadmium and hexavalent chromium) above specified limits. We can quickly verify compliance with Restriction of Hazardous Substances (RoHS), Waste Electrical and Electronic Equipment (WEEE), and End of Life Vehicle (ELV) directives.
In addition to performing general-materials testing, including analysis of plating bath solutions, we are currently certified to refinish Ball Grid Array (BGA) and Quad Flat-Pack (QFP) components in conformance with RoHS directive 2002/95/EC as defined by JEDEC-JESD97.
Our on staff IPC-certified trainer is part of our commitment to our customers certification to the most recent standards, IPC-A-610. This certification, published in 2010, covers quality control for the newest electronics assembly procedures and components, including board-in-board and package-on-package assemblies, Pb-free, new SMT termination styles and advances in mechanical assemblies, cleaning, coating and laminates.