Micross AIT offers a wide array of flip chip assembly capabilities, from single chip placements to multi-chip module and system-in-package assembly of multiple die and components.
- Flip chip assembly for single and multi-chip applications
- Precision die placement with accuracies better than +/- 0.5 microns
- Heterogeneous integration with Si, III-V and other device types/materials
- Plasma Assisted Dry Soldering (PADS) Process enables true fluxless for assembly for Sn-bearing solders