Flip Chip & Multi-Chip Module Assembly

Micross AIT offers a wide array of flip chip assembly capabilities, from single chip placements to multi-chip module and system-in-package assembly of multiple die and components.

  • Flip chip assembly for single and multi-chip applications
  • Precision die placement with accuracies better than +/- 0.5 microns
  • Heterogeneous integration with Si, III-V and other device types/materials
  • Plasma Assisted Dry Soldering (PADS) Process enables true fluxless for assembly for Sn-bearing solders

cms modules flip chip

For more information, contact Alan Huffman.