Transys

Transys offers a specialist range of Power discretes in wafer and bare die form. The company prides itself in it's flexibility and willingness to make a customised product. The range of bare die and wafer that Transys offers addresses the specialty end of the market where a custom product enables a market edge.

Empower custom designs and enhance applications

Designers looking to give their products a market edge can leverage some of the natural advantages of working at the bare die level. A bare die product is simply a package-free semiconductor and allows the system designer to use the full potential of bare die form without incurring the penalties such as degraded electrical performance or temperature limitations that can result from using the product in a standard package format. Bare die products also allows more efficient use of limited space.

Bare Die Benefits

• Reduced space volume envelope - Removing heat sinks and package surround by direct die attached to substrate gains highest power density with lowest volume area and height profile
• Ruggedization - Bare die can add reliable operating capability in harsh environments. Direct die attach and wirebond to substrate eliminates exposed weak spots in package interconnect caused by temperature excursions. Lowest contact area to substrate = lowest CTE. Direct die attach and wirebond also ruggedizes against high levels of vibration and shock
• Thermal Uprating - Utilise the true maximum rated allowable junction temperatures of the die without package temperature limitation
• Add Integration - Go to bare die level to create and add extra power density into unusual footprints and create customised modules for space constrained systems

Note: Performances will vary depending on assembly techniques and substrate choices

Transys Die / Wafer advantages:

• Large die sizes - Where thermal handling and power density matter then TranSys have capability to make larger die other factories would not consider
• Custom Electrical Selection - Full parameter selection & grading for custom requests, i.e. IGT selection for Triacs
• Custom Metalisation - Unlike mass production processes where metal choice for die and wafer is usually fixed, TranSys offer a custom choice of die metal for either wirebondable applications or solderable applications (and even both if needed). Metal thickness can also be specified

Applications

All Industrial & Consumer Applications

Power Specific Applications:

• Relays
• Power Modules
• Surge Protection Modules
• Hybrid Circuits
• Custom Discrete Assemblers

Products

• Triacs - 200V to 2200V, from 5A to 40A
• High Voltage Rectifiers - 1200V to 2200V, from 11A to 110A
• Single Die Transient Voltage Suppressors - 6.8V to 500V, from 400 to 40,000 WATTS
• Flip-Chip Die Transient Voltage Suppressors - 6.8V to 500V, from 400 to 40,000 WATTS

Availability between product lines may vary and in some circumstances minimum order values will apply. Please check with Micross Components.

To view our full list of Wafer Services and Process Flow please click here.

To view our Shipping Methods please click here.

To view our full Bare Die Linecard please click here.