Empower custom designs and enhance applications
Designers looking to give their products a market edge can leverage some of the natural advantages of working at the bare die level. A bare die product is simply a package-free semiconductor and allows the system designer to use the full potential of the bare die form without incurring the penalties such as degraded electrical performance or temperature limitations that can result from using the product in a standard package format. Bare die products also allows more efficient use of limited space.
Bare Die Benefits
The package for today’s memory devices is typically a major reason for the large surface area needed on board real-estate. Whether bga or peripherally pinned the high number of i/o associated with memory means in any packaged format routing to the board takes up more space. However by using bare die it is possible to reduce the X-Y footprint down to very close to and in some cases even the size of the die itself. This is achieved by either wire bonding depending on the bare die pad configuration or bumped die and flip chip attach. In addition using memory in bare form can also help assist with reliability sensitive applications, harsh environments and used in conjunction with other semiconductor devices can enable the production of complete modular system using bare die in the form of either hybrids or multiple-chip-modules.
Applications
- Hybrid Circuits
- Custom Ceramic Packages
- Multiple-Chip-Modules (MCM)
- Multiple-Chip-Packages (MCP)
- System-In-Package (SIP)
Products
- Parallel Flash
- Serial Flash
Availability between product lines may vary and in some circumstances minimum order values will apply. Please check with Micross Components.
Micross Services
- Design Assistance
- Assembly assistance
- Die handling consultancy
- Hi-Rel die qualification
- Hot and Cold die probing
- Die Programming
- Die Taping - Pocket / SurfTape
- And more...
Product Support
All die products supplied are processed by Micross Components, Spansion (formerly AMD) product support partner, who have over 25 years experience in bare die supply. Working in conjunction with Micross Components, Spansion (formerly AMD) is able to offer die products with the high level of quality and reliability needed to give confidence to multi-chip module & hybrid builders. Flexible product specific customised process flows can also be created on request to Micross Components. With Micross as your supplier all product forms whether wafer, wafers or singulated bare die, undergo 100% visual inspection before packing and are accompanied by a Certificate of Conformance from us guaranteeing that the bare die you buy meet the chosen specification and supply format ordered.
To view our full list of Wafer Services and Process Flow please click here.
To view our Shipping Methods please click here.
To view our full Bare Die Linecard please click here.
