Sensitron Semiconductor (SENS)

Empower Hi-Rel Custom designs and enhance Hi-Rel applications

Designers looking to give their products a market edge can leverage some of the natural advantages of working at the bare die level. A bare die product is simply a package-free semiconductor and allows the system designer to use the full potential of the bare die form without incurring the penalties such as degraded electrical performance or temperature limitations that can result from using the product in a standard package format. Bare die form products also allows more efficient use of limited space.

Bare Die Benefits

• Improve switching efficiency - Reducing path lengths by removing extra package interconnect can reduce capacitance and lower inductance
• Reduced space volume envelope - Removing heat sinks and package surround by direct die attached to substrate gains highest power density with lowest volume area and height profile
• Ruggedization - Bare die can add reliable operating capability in harsh environments. Direct die attach and wirebond to substrate eliminates exposed weak spots in package interconnect caused by temperature excursions. Lowest contact area to substrate = lowest CTE. Direct die attach and wirebond also ruggedizes against high levels of vibration and shock
• Thermal Uprating - Utilise the true maximum rated allowable junction temperatures of the die without package temperature limitation
• Add Integration - Go to bare die level to create and add extra functionality into unusual footprints or space constrained systems
  Note: Performances will vary depending on assembly techniques and substrate choices

These die advantages promote higher levels of integration using existing mature products, lead to increased functionality per square area, and reduce costs. Additionally, performance improvements are achieved with no additional cost penalty. Integrating die for SiP (System-in-Package) solutions provides a benefit over both standard package solutions and SOC (System-on-Chip) solutions. As design cycle time requirements continue to shorten and product time to market becomes increasingly important, die for SiP solutions finds greater utility in meeting the designer's needs.

Applications

• Military/Aerospace Hybrids / MCMs
• Medical Measurment Devices
• High Temperature Electronics
• Automotive Electronics
• Industrial Sensor Module

Products

• Rectifiers
• Schottky diodes
• Transient Voltage Suppressors - TVS

Availability between product lines may vary and in some circumstances minimum order values will apply. Please check with Micross Components.

Services

• Design Assistance
• Assembly assistance
• Die handling consultancy
• Hi-Rel die qualification
• Hot and Cold die probing
• Zener Zap trimming
• Die Taping - Pocket / SurfTape

Product Support

Sensitron wafer and die products supplied are supported by Micross Components, Sensitron die product support partner, who have over 25 years experience as a bare die supplier. Working in conjunction with Micross Components, Sensitron is able to supply die products with the high level of quality and reliability needed to give confidence to multi-chip module & hybrid builders. Flexible product specific customised process flows can also be created on request to Micross Components. All product forms supplied undergo 100% visual inspection before packing and are accompanied by a Certificate of Conformance from us guaranteeing that the die you buy meet the chosen specification and supply format ordered.

To view our full list of Wafer Services and Process Flow please click here.

To view our Shipping Methods please click here.

To view our full Bare Die Linecard please click here.