Fairchild Semiconductor (FCH)

Empower custom designs and enhance applications

Designers looking to give their products a market edge can leverage some of the natural advantages of working at the bare die level. A bare die product is simply a package-free semiconductor and allows the system designer to use the full potential of bare die form without incurring the penalties such as degraded electrical performance or temperature limitations that can result from using the product in a standard package format. Bare die products also allows more efficient use of limited space.

Bare Die Benefits

• Improve switching efficiency - Reducing path lengths by removing extra package interconnect can reduce capacitance and lower inductance
• Reduced space volume envelope - Removing heat sinks and package surround by direct die attached to substrate gains highest power density with lowest volume area and height profile
• Ruggedization - Bare die can add reliable operating capability in harsh environments. Direct die attach and wirebond to substrate eliminates exposed weak spots in package interconnect caused by temperature excursions. Lowest contact area to substrate = lowest CTE. Direct die attach and wirebond also ruggedizes against high levels of vibration and shock
• Thermal Uprating - Utilise the true maximum rated allowable junction temperatures of the die without package temperature limitation. E.g. FDP8870 Mosfet Continuous Drain Current has bare die potential up to 156A whereas the package casing limits ID to 80A
• Add Integration  - Go to bare die level to create and add extra functionality into unusual footprints or space constrained systems

Note: Performances will vary depending on assembly techniques and substrate choices

Applications

All Industrial & Consumer Applications

• Hybrid Circuits
• Custom Ceramic Packages
• Power Modules
• Multiple-Chip-Modules (MCM)
• Multiple-Chip-Packages (MCP)
• System-In-Package (SIP)

Power Specific Applications:

• AC / DC Conversion
• Power Drives
• Solar Inverters

Products

• Power Mosfets - Low & High Voltage
• IGBTs - NPT, Field Stop, Trench Field Stop
• Small Signal Discrete - BJTs, JFETS
• Logic - CD4K, AS, ALS, HC, FACT,ABT, VHC, ECL
• UHS, LCX, LVT, ALVC,VCX, DIMM,GTLP, FXL
• Analog - Amplifiers, Comparators, Switches, Signal Convertors

Availability between product lines may vary and in some circumstances minimum order values will apply. Please check with Micross Components.

Micross Services

• Design Assistance
• Assembly assistance
• Die handling consultancy
• Hi-Rel die qualification
• Hot and Cold die probing
• Zener Zap trimming
• Die Taping - Pocket / SurfTape
• And more...

Product Support

All die and wafers supplied are processed by Micross Components, Fairchild's product support partner, who have over 25 years experience in bare die supply. Working with Micross Components, Fairchild is able to supply die and wafer products with the high level of quality and reliability needed to give confidence to multi-chip module & hybrid builders. Wafers go through a rigorous sorting process to ensure a high degree of reliability. Flexible product specific customised process flows can also be created on request to Micross Components. As your bare die supplier all product undergoes 100% visual inspection before packing and is accompanied by a Certificate of Conformance guaranteeing that the bare die you buy meet the chosen specification and supply format ordered.

To view our full list of Wafer Services and Process Flow please click here.

To view our Shipping Methods please click here.

To view our full Bare Die Linecard please click here.