Cypress delivers high-performance, high-quality solutions at the heart of today’s most advanced embedded systems, from automotive, industrial and networking platforms to highly interactive consumer and mobile devices. With a broad, differentiated product portfolio that includes NOR flash memories, F-RAM and SRAM, Traveo™ microcontrollers, the industry’s only PSoC® programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense® capacitive touch-sensing controllers, and Wireless BLE Bluetooth® Low-Energy and USB connectivity solutions, Cypress is committed to providing its customers worldwide with consistent innovation, best-in-class support and exceptional system value.
Cypress Semiconductor Corp. is listed on the NASDAQ stock exchange under the ticker symbol CY. Based in San Jose, California, the company has 7,100 employees worldwide serving more than 30,000 customers.
- NOR Flash
- NAND Flash
- Asynch SRAM
- Synch SRAM
Designers looking to give their products a market edge can leverage some of the natural advantages of working at the bare die level. A bare die product is simply a package-free semiconductor and allows the system designer to use the full potential of the bare die form without incurring the penalties such as degraded electrical performance or temperature limitations that can result from using the product in a standard package format. Bare die products also allows more efficient use of limited space.
Bare Die Benefits
Bare Die Space Savings The package for any microcontroller or memory is typically a major reason for the large surface area needed on board real estate. Whether BGA or peripherally pinned, the high number of I/Os associated means any packaged format attached to a PCB will take up more space. However, by using bare die it is possible to reduce the X-Y footprint down to very close to and, in some cases, even the size of the die itself. This is achieved by either wire bonding (depending on the bare die pad configuration) or bumped die and flip chip attach.
Additionally, using bare die form can also help assist with reliability sensitive applications, harsh environments and can be used in conjunction with other semiconductor devices which enable the production of complete modular system such as hybrids or Multiple Chip Modules (MCMs).
Bare die can also be used to increase functional integration by combining other bare die inside a single package. This is often referred to as a Multiple Chip Package (MCP) and is achieved by either stacking die or laying die side-by-side.
- Design assistance
- Assembly assistance
- Die handling consultancy
- Hi-rel die qualification
- Hot and cold die probing
- Zener Zap trimming
- Die taping - Pocket/SurfTape
- And more...
With over 35 years experience in bare die supply, Micross Components is proud to be a product support partner for .
Working in conjunction with Micross Components, is able to offer die products with the high level of quality and reliability needed to give confidence to multi-chip module hybrid builders. Flexible product specific customized process flows can also be created on request to Micross Components.
With Micross as your trusted supplier, all product forms (wafers or singulated bare die) undergo 100% visual inspection before packing. Additionally, a Certificate of Conformance is included which guarantees your bare die meet the chosen specification and supply format ordered.