Atmel
Empower custom designs and enhance applications
Atmel Corporation is a worldwide leader in the design and manufacture of microcontrollers, capacitive touch solutions, advanced logic, mixed-signal, nonvolatile memory and radio frequency (RF) components. Leveraging one of the industry's broadest intellectual property (IP) technology portfolios, Atmel is able to provide the electronics industry with complete system solutions focused on industrial, consumer, security, communications, computing and automotive markets.
Designers looking to give their products a market edge can leverage some of the natural advantages of working at the bare die level. A bare die product is simply a package-free semiconductor and allows the system designer to use the full potential of the bare die form without incurring the penalties such as degraded electrical performance or temperature limitations that can result from using the product in a standard package format. Bare die products also allows more efficient use of limited space.
Bare Die Benefits
The package for any microcontroller or memory is typically a major reason for the large surface area needed on board real-estate. Whether bga or peripherally pinned the high number of i/o associated means in any packaged format routing these to the board takes up more space. However by using bare die it is possible to reduce the X-Y footprint down to very close to and in some cases even the size of the die itself. This is achieved by either wire bonding depending on the bare die pad configuration or bumped die and flip chip attach. In addition using bare form can also help assist with reliability sensitive applications, harsh environments and used in conjunction with other semiconductor devices can enable the production of complete modular system using bare die in the form of either hybrids or multiple-chip-modules.
Bare die can also be used to increase functional integration by combining other bare die inside a single package. This is often referred to as MCP - Multiple Chip Package and is achieved by either stacking die or laying die side-by-side.
Applications
- Hybrid Circuits
- Custom Ceramic Packages
- Multiple-Chip-Modules (MCM)
- Multiple-Chip-Packages (MCP)
- System-In-Package (SIP)
Products
Die availability between product lines may vary and in some circumstances minimum order values will apply. Please check with Micross Components.
Micross Services
- Design assistance
- Assembly assistance
- Die handling consultancy
- Hi-Rel die qualification
- Die programming
- Die Taping - Pocket / SurfTape
- And more...
Product Support
All die products supplied are processed by Micross Components, Atmel product support partner, who have over 25 years experience in bare die supply. Working in conjunction with Micross Components, Atmel is able to offer die products with the high level of quality and reliability needed to give confidence to multi-chip module & hybrid builders. Flexible product specific customised process flows can also be created on request to Micross Components. With Micross as your supplier all product forms whether wafer, wafers or singulated bare die, undergo 100% visual inspection before packing and are accompanied by a Certificate of Conformance from us guaranteeing that the bare die you buy meet the chosen specification and supply format ordered.
To view our full list of Wafer Services and Process Flow please click here.
To view our Shipping Methods please click here.
To view our full Bare Die Linecard please click here.