Silicon Chip Capacitors

IPDiA – The 3D Silicon Solution

Micross is pleased to announce its partnership with IPDiA, France.

Micross in conjunction with IPDiA are able to give our customers a unique solution to common problems experienced by ceramic chip capacitors. IPDiA has developed a new technology which allows for greater integration of components, without compromising on performance and quality.

Poor Reliability (Performance, Cracking etc.)	Source Product High Reliability Product
Size of Components / Designs	Source small components, Integrate components / Embedded Solution
High Leakage Current	Source Product with Low Leakage Current
Voltage and Poor Temperature Stability	Source Product which has High Stability & High Temperature
Poor decoupling efficiency	Source product with efficient optimising decoupling, low ESL
Space constraints	Look at Embedded / Integrated Capacitors
Oversizing capacitor values	Source High Stability Product that can operate at full temperature & Voltage Without oversizing

Applications include commercial, Hi-Rel, Space, Medical (both external and implantable), Industrial and Automotive.

Their PICS technology allows for enhanced performance in 3 main areas:

• 3D Silicon Capacitors
• ASPICS - Application Specific Passive Integration Components
• Integrated Passive Devices (IPD) - With or without TVS

Micross Components can offer small MOQ’s, Low Costs and Short Lead Times.

Silicon Capacitors

The unique PICS technology allows for a greater integration of capacitance, allowing for a wide variety of capacitance on Silicon. Due to the nature of the product, high values can be achieved in sizes from 01005. Product Ranges include:

• Pin-for-Pin replacements on standard JEDEC part numbers
• High Stability

HSSC1005

HSSC0201 HSSC0402 HSSC0603 HSSC0805 HSSC1206

• High Temperature

HTSC1005

HTSC0201 HTSC0402 HTSC0603 HTSC0805 HTSC1206

• Extreme Temperature

XTSC1005

XTSC0201 XTSC0402 XTSC0603 XTSC0805 XTSC1206

• Low Profile

LPSC1005

LPSC0201 LPSC0402 LPSC0603 LPSC0805 LPSC1206

• Wire Bondable
• COB Silicon Capacitors
• Embedded Capacitors

For more information on each product group, please click on the relevant component

ASPICS

With Capacitors and RF Components

Application Specific Passive Integrated Components (ASPICS) have been developed by IPDiA to enable the customer to get the best performance with the smallest footprint possible.

This technology can save up to 80% of the PCB that are currently required by SMD components as well as increasing performance, simply by replacing standard SMD with PICS.

The IPD technology allows for a wide variety of passive components from capacitors and RF components to be integrated onto one silicon solution.

Benefits include:

Multiple benefits come from using ASPICS technology such as;

• Shorter Design Cycles
• Reduced overall cost and manufacturing throughput time
• Reduces Size for space critical applications
• Better and more stable performance
• Protected IP Key Benefits
• Ease of integration and use in SIP, MCM, MEM and Hybrids

With Operating Temperatures of -40°C to +150°C these ASPICS and RF components are suitable for a number of applications including Telecommunications and Wi-Fi.

IPD & TVS

Specifically designed for HB LEDs, IPDIA ESD protection devices offer optimum performance and size. Manufactured on both Silicon and ceramic sub-mounts, these Integrated Protection Devices can be used as an interposer between the HB LED and the package lead frame.

Products include:

HB LED TVS Diodes

HB LED Sub mounts

Other Protection Devices

Main Features Include:

• Available in Unidirectional and Bidirectional
• Flip Chip Packaging with several metallisation options
• Released to
  • MIL-STD 883
  • IEC 61000-4-2
  • JEDEC JESD22
  • IEC61000-4-5

IPDiA unique silicon integrated back-to-back TVS diodes allow for maximum miniaturisation.

Available in multiple shipping mediums including unsawn wafer, sawn wafer on foil or ring frame, or waffle pack For further information, please contact us.