Custom Device Packaging

Packaging/Bonding Services

Micross Components has developed Europe's widest range of packaging capabilities and techniques that allow us to handle practically any interconnection requirement. This packaging capability is available to customers as a sub-contract manufacturing service.

Semiconductor die may be packaged on laminate (chip on board), or for more specialist applications ceramic or metal can packages, to customer specification. Product screening and test services are also available if required.

Manufacture of standard modules (packaged part on laminate substrate) or mixture of packaged part and chip on board are also available as sub contract manufacturing services.

Micross Components possesses many years experience packaging a wide range of semiconductor technologies, some of which are listed below:

Amplifiers	Modulators
A/D & D/A converters	Rectifiers
Crystals	Regulators
Comparators	Switches
Diodes	Operational amplifiers
Drivers/Receivers	Phase locked loops
Logic	Transistors
FET	Voltage references
Memories	V to F converter

Emulation/Replacement

Micross Components 'Hermes' product facilitates packaging of semiconductor die in plastic package in low (<50pcs) to medium volume. The product may be manufactured to emulate an industry standard plastic package footprint (SOP, TSOP, PLCC, QFN) or provide a unique customer specific footprint.

Based on a laminate substrate with gold solderable lands on the underside Hermes may be designed with a wide variety of footprints. A full range of die types may be wire bonded to the top surface and epoxy coated to provide mechanical protection and a flat surface for pick and place applications. Full electrical test is available, at temperature extremes, if required.

A low volume plastic packaging technology is also available to manufacture plastic TO type packages in low to medium volume. Please contact us for more information.

RF Die Packaging

Micross Components has many years experience of the unique requirements of packaging semiconductor die for R.F applications. Our highly experience bonding technicians are able to develop production processes to match a wide range of customer requirements. Capability exists to package in plastic QFN package, ceramic package or Chip on Board.

Standard Packages

Micross Components package semiconductor die into fully moulded, standard plastic package including:

• SOIC(16) Wide body
• SOIC(24)
• PLCC(24)

In volumes of 5,000pcs (minimum) per lot.

System in Package

Micross Components prime focus is miniaturisation of electronic systems. We design, manufacture and test innovative solutions to application specific electronic component packaging problems. A carefully constructed, fully tested, System in Package solution not only significantly increases system functionality, it also increases reliability by reducing interconnect on the system board.

A range of techniques has been developed to address the demands of various applications. A standard Chip on Board (laminate) approach is the standard solution, increasing density by eliminating the plastic package. Double sided modules with die top and bottom further increase die packaging density.

Flip chip on board (Gold stub bumped die) takes space saving to another level by eliminating the area required for wire bond, it is also offers the potential to increase performance in high frequency systems by reducing the length of interconnect.

For systems requiring a processing element then a combined surface mount assembly/chip on board approach is often the most appropriate. Eliminating the high die costs (minimum order) and bare die test costs associated with processor, DSP and FPGA die product.