Custom Device Packaging
Custom Products
Micross Components's product development team excels at defining and delivering product and/or packaging solutions from modifying standard products to designing full custom products. Modifications and design starts from either a generic requirement communicated during a customer visit or a fully documented descriptive request received via a customer's source drawing (SCD). With over 20 years experience in definition, design and test of products and packaging for the high-reliability marketplace, we have prided ourselves in the quality of our turn-key service approach that we provide to our customer base. Our designs take into consideration manufacturability, testability, quality and long-term reliability, with particular attention to obtaining these goals within project cost guidelines.
Design Capabilities
Silicon
Standard
| CERAMIC |
PLASTIC |
| CDIP (300, 400, 600 mil) |
CAN |
| ZIP |
TSOP |
| CSOJ |
TQFP |
| CQFP |
QFN |
| CPGA |
PBGA |
| LCC |
PSOJ |
| FLATPACK |
PLCC |
Custom
Per Requirement
Hermetic & Plastic Packaging