Sensors/Nanotechnology
Micross Components are sensor die packaging experts. Our experienced engineering and production team are able to provide solutions to special (often unusual) customer packaging requirements.
We offer:
- Design services
- Prototype manufacture
- Design for manufacture
- Medium quantity production (UK facility)
- Mass production (ASIA facility)
We package sensor on laminate, flex, glass or ceramic substrates. Please contact us to discuss your specific requirements.