Medical

Micross Components provide semiconductor die and sensor/MEM packaging services to a wide range of medical customers. Typical services include:

• Prototyping services – Start up companies or New products
• Sensor packaging – Including specialised die attach/alignment and specialist wire bond
• Miniaturisation – Reduce size/change aspect ratio
• Production ready – From prototype to low quantity production
• Production services – Die/Sensor packaging or COB/SMA assembly to specification – medium volume (UK manufacture) or mass production in Micross Components (ASIA) facility

Micross Components also work with a select range of medical customers in joint venture arrangements jointly developing innovative new products for the medical marketplace.