Standard Hermetic/Ceramic Products
Since the early 1990's Micross Components have manufactured a wide range of ceramic (and metal can) packaged product. A number of these products are still available today, which may be purchased to support legacy projects.
Product range:
Please select from the drop-down list below.
Packaging Services
Micross Components has developed Europe's widest range of packaging capabilities and techniques that allow us to handle practically any interconnection requirement. This packaging capability is available to customers as a sub-contract manufacturing service.
Semiconductor die may be packaged into ceramic, metal or laminate (chip on board) packages to customer specification. Product screening and test services are also available if required.
Micross Components possess many years experience packaging a wide range of semiconductor technologies, some of which are listed below:
| Amplifiers |
Modulators |
| A/D & D/A converters |
Rectifiers |
| Crystals |
Regulators |
| Comparators |
Switches |
| Diodes |
Operational amplifiers |
| Drivers/Receivers |
Phase locked loops |
| Logic |
Transistors |
| FET |
Voltage references |
| Memories |
V to F converter |