Flip Chip Technologies
As part of our growing capability in package assembly test and screening Micross Components Ltd is now able to offer flip chip assembly, using un-bumped bare die.
Using a high-speed process we can stud bump bare die not only in volume but at low cost. This unique process allows us to stud bump at any stage, on wafer prior to saw, on singulated die, onto the substrate, flex or edge connector ready for flip-chip attachment.
Why change the metalisation of the semiconductor to a non-standard metal?, when stud bumps use standard wafer technology. Maintaining flexibility, stud bumps have been demonstrated to work over the majority of major manufacturer's die product.
Not only are stud bumps low cost, flexible, use standard metalisations, they have technical advantages over most other methods.
- Low profile
- Low inductance
- Large choice of attachment techniques
- No obstruction to heat flow
- Ease of placement
- Co-planarity compensation
- Wafer or singulated die
Wafer & Die Level Gold Bumping
- Low NRE Wafer or Single Die bumping
- 99.8% Au = Hi-Rel Au to Al/Au Interconnect
(No Ni or UBM required)
- Low profile, low inductance
- No obstruction to heat flow
- Die Attach via Thermocompression or Anisotropically
Technical Specification
Material 99.8% Au
Min height 40µm
Max height 70µm
Planarity ± 5µm (1µm with post-coining)
Min pitch 75µm
Bump Shear strength 50-75g
Min bump diameter 75µm ± 3µm
Max bump diameter 100µm ± 3µm
Min post diameter 25µm ± 0.01µm
Max post diameter 33µm ± 0.01µm
For further information on these processes, please don't hesitate to contact us.