Electrical Test
Devices are available in die or wafer form or in a variety of standard and custom semiconductor packages. Devices may be tested against manufacturers' data book limits, customer-specified limits or BS, CECC, MIL or SPACE test methods.
Temperature range for die/wafer 25°C to +200°C
Temperature range for packaged devices –70°C to +200°C
Product types include the following:
- Analogue Operational Amplifiers
- Comparators
- Voltage Regulators
- Voltage References
- Analogue Switches
- Multiplexers
- Analogue to Digital Convertors
- Power management IC's
- Switched Mode Controllers
- Transistors
- Diodes
- Triacs
- Power HEXFET's
- Discrete functions
- Digital 54 and 74 Logic Series
- CMOS
- Bipolar
- Line Drivers
- Decoders
- Level translators
- Digital to Analogue converters
- Special functions
- Memory PROM programming for die and packaged devices
- ASIC/Custom Test programme development on request
Common Process Routes
Hover your cursor over the below to see the process flow diagrams or click here to return to main process flow page.