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Micross Advanced Interconnect Technology To Deploy Column Grid Array (CGA)

Posted: March 2017

Orlando, FL, March 21, 2017 - Micross is pleased to announce that a new state-of-the-art fabrication line for its column grid array (CGA) technology will be installed at its Micross Advanced Interconnect Technology (Micross AIT) ITAR-registered facility in Research Triangle Park, NC in 2017, bringing this proven, high-reliability interconnect technology to an on-shore U.S. provider.

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Micross Advanced Interconnect Technology Site Receives AS9100:2009 / ISO9001:2008 Quality Management Certification

Posted: March 2017

Orlando, FL, March 13, 2017 – Micross today announced that it has secured AS9100 Rev. C / ISO9001:2008 certification at its premier wafer bumping and wafer-level packaging research & fabrication facility, Micross Advanced Interconnect Technology, LLC (Micross AIT) located in Research Triangle Park, NC.

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2017 Micross Products & Services Brochure

Posted: March 2017

Our products and services are found across all market segments where applications require faster, smaller and lighter products to be used in the most demanding environments.

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Micross Retail+TM Products

Posted: February 2017

Explore our exclusive line of reballed / lead-solder exchanged and screened components for hi-rel, long-life applications.

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Micross Components Acquires RTI International's Microsystem Integration and Packaging (MIP) Group

Posted: October 2016

ORLANDO, Florida, October 5, 2016 – Micross Components, Inc. (“Micross”) headquartered in Orlando, Florida is pleased to announce the strategic acquisition of RTI International’s Microsystem Integration and Packaging (“MIP”) Group, one of the premier wafer bumping and wafer level packaging research and fabrication facilities in the United States, servicing commercial and government clients, situated in Research Triangle Park, North Carolina.

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