High Temperature Solder Lead Attachment Process
For Pretinned LCCs .350" square or larger
The tin-lead phase diagram below shows the temperatures associated with the various phases for several tin-lead compositions. Micross Components utilizes 5Sn-95Pb for lead soldering due to its relatively high liquids temperature. This allows further processing of the leaded packages without concern for 60Sn-40Pb solder reflow temperatures affecting the lead attach. This method of lead attach often exceeds the stringent lead integrity requirements of MIL-STD-883. But are the electrical characteristics of the device affected? No. Hundreds of thousands of devices have had leads attached utilizing Micross Components's post-assembly high temperature lead attach process with proven success after board mounting time and time again.
GENERAL SPECIFICATIONS: All copper post-attached round lead chip carriers shall be capable of meeting requirements of MIL-STD-883 Group D (package related, all classes) Method 5005 subgroups:
- Physical Dimensions
- Lead Integrity
- Thermal Shock
- Mechanical Shock
LEAD MATERIAL: Copper, CDA 102, ASTM B-170 grade 2 Resistivity Max. 1532 Vg/m2 @ 20°C, Thermal conductivity 226 Btu/Ft•Hr•°F
FINISH: Hot solder dip IAW MIL-M-38510 (63/37)