SMT Lead Alignment

Traditionally components that have been rejected at the surface mount placement stage due to mechanical defects, have been scrapped at a total loss financially to the manufacturer. At Micross Components we have developed a totally automated process which allows us to re-align the legs of the component, bringing it back to original specification. This service offers potentially huge savings to OEM and CEM companies.

Before Lead Alignment

After Lead Alignment

Spit out, BGA Reballing and Lead Alignment

Valuable components recovered.

BGA's Re-balled, inspected and packaged to a quality standard suitable for machine placement.

Automated Realignment

Computer controlled correction of misaligned leads. Majority of packages handled including QFP, SOIC, TSOP and BQFP. Including realignment of the leads on harvested components.

Automated Inspection

All components are 100% inspected for dimensional accuracy to component drawings.