PCB Reworking
PCB rework and X-Ray inspection
Micross Components Component's special rework and repair service is dedicated to providing a quality service to recognised IPC standards.
- IPC A 610 class 1, 2,3. Workmanship standards and acceptability of electronic assemblies
- IPC 7711 Rework of electronic assemblies
- IPC 7721 Repair and modification of PCB and electronic assemblies
Automated removal and replacement of components BGA, Micro BGA, Flip Chip. Plus majority of fine pitch components handled.
Micross Components Component's specialist rework service is enhanced by the in-house capability to X-Ray inspect a variety of electronic components.
X-RAY inspection of PCB assembly
X-Ray inspection includes component
such as: BGA CSP Encapsulated devices
PCB rework
Investment in state of the art technology ensures control, repeatability and quality of repair.
Also available for Pb-Free initiatives:
- X-Ray Fluoresence Testing for Pb-Free components
- X-Ray Fluorescence Testing and verification for compliance to EU Directives, RoHS, WEEE, and EVL
- Screening for concentrations of Pb in products above specified limits
Component Harvesting
Micross Components can recover valuable components from assembled boards, using a variety of methods. All recovered components are suitable for machine placement and are returned in either trays or tape and reeled. These are then dry packed in moisture barrier bags with humidity card and desiccant.
Micross Components will also dispose of any boards in an environmentally friendly process compliant with ISO 14001.
In the event of a large volume of boards Precious Metal Recovery may be possible with a profit share once assay has been confirmed.
Ionic contamination testing against MoD, DEF and MIL specifications is also available.