Hi-Rel Lead Attach/Replacement
Lead Attach
Choice of Attachment Process
Round lead ceramic chip carriers were developed in response to the need for a family of low cost leaded chip carriers, capable of meeting the requirements of MIL-M-38510 and MIL-STD-883, while providing the compliance between the ceramic chip carrier and the PWB.
The round lead was chosen for its ability to locate itself into the castellation of the leadless chip carrier and be attached by thermocompression welding of gold plated finished LCC's or tin-lead soldering of pretinned LCC's. Since the attachment processes are achieved with heat and pressure in milliseconds, the leads can be attached after the complete assembly of the electronic device. Thus, the semiconductor manufacturer can utilize one process to provide LCC's or leaded chip carriers. Previously, each type of package required a specific production line with distinct tooling and processes to provide “J”, “Gullwing”, and the various other lead forms. Now all chip carriers can be processed through end of line as LCC's.
The final lead form is selected and the leads attached, formed, and hot solder dipped in eutectic solder, just prior to shipment or board mounting. The advantages of the single processing are reflected in higher quality and lower costs. Users of chip carriers can significantly increase the reliability of the PWB assembly by adding leads to readily available LCC's. Lead forms are available to meet every design and operations requirement.
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Lead Replacement
- Have problems with thermal cracking because of insufficient stress relief?
- Leads cut too short?
- Footprint mismatch?
Micross Components has successfully replaced and reformed leads on 68 lead and 84 lead electronic components for several major military contractors. The applications were for use in helicopters, missiles and satellites.
Each customer conducted rigorous testing to validate the lead strength and reliability for their application. All product testing resulted in complete success and corrected quality and reliability issues in a timely and cost effective way.