Conversion to leaded spheres for
Before & After BGA Reballing
Micross Components has developed a proven process for reballing Ball Grid Array (BGA) components to restore them to their original specifications or to bring them up to standards for use in hi-rel applications.
Low-cost, quick-turn low-volume processing
Single reflow reballing minimizes heat exposure
Turnkey product purchasing
- Processing of ceramic and plastic BGAs and LGAs
- Ball pitch from 0.40mm
- Pb-free ↔ Sn/Pb balls
Low & High Volume Processes
Micross’ low-volume process eliminates the need for custom tooling and preforms. Our high-volume process utilizes custom tooling for lower piece-part cost.
Our proprietary automated wave solder deball process completely removes the original solder sphere and pad finish. For an ultra-controlled, non-contact deball process, our exclusive Micross Robotic Hot Solder Dip equipment can also be used.
- Optical inspection for sphere condition
- Automated inspection for sphere size and placement
- Ball shear
- Ionic cleanliness
- Electrical testing
Whether your product is consigned to Micross or we purchase product for you, Micross is able to manage your entire BGA product inventory.
- ISO9001 and AS9100 registered
- ESD-safe environment
- Temperature and humidity controls