Ball Grid Array (BGA) Reballing

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Proven BGA Reballing Process

Micross Components has developed a proven process for reballing Ball Grid Array (BGA) components to restore them to original specification for reuse.

The process can be used with a wide assortment of BGA packages (including micro-BGAs) and solder-ball spheres, including Pb, Pb-free and high-melting point solder alloys.

BGA Reballing - before the process

Before Reballing

BGA Reballing - after the process

After Reballing

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