Automated Dipping and Solder Exchange
Micross has designed and developed an automated solder dipping process capable of conforming to GEIA 006.
The process includes:-
- Computer control of a six axis dipping robot.
- Solder dipping completed under a Nitrogen blanket.
- Solder level sensing for accurate solder dipping.
- Integral component wash and dry facility.
- Preheating of components to negate thermal shock.
The automated process is capable of handling most package styles but is not limited to them due to innovative handling fixtures.
Typical component packages styles handled to date are:
- Semi conductors,
- Passives
- Electro mechanical components
Integral part of process policing includes XRF measurement of the solder baths and were appropriate solderability checking.
Solderability Checking in line with NPL best practice.
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