Robotic Solder Exchange

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Automated Dipping and Solder Exchange

To increase component reliability (and mitigate tin-whisker formation), Micross Components has developed a robotic, automated solder-dipping process that enables us to replace the unwanted finish on a wide range of electronic components, regardless of packaging style.

Solder ExchangeThe GEIA-STD-0006 compliant process includes:

  • Robotic-controlled six-axis dipping
  • Solder dipping under a nitrogen blanket
  • Solder-level sensing for accurate solder dipping
  • Integral component wash and dry facility
  • Preheating of components to negate thermal shock

We are capable of handling a wide variety of component types,
including the following:

  • Semiconductors
  • Passives
  • Electro-mechanical components

We also provide in-house solderability testing and X-ray Fluorescence (XRF) scanning services to identify component-finish types.

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