Bare Die Line Card
Whether your design needs unencapsulated product or a custom packaged solution, it all starts with the die. Micross Components is proud to be endorsed by all of these semiconductor manufacturers to handle their wafer and die products.
If you are interested in manufacturer not listed here and would like to buy bare die, please contact a member of our sales team.
Our aim is to provide the bare die user with a full suite of different components so a complete application can be designed and realized at the die level. Amongst our portfolio you will find a wide range of products from the simplest diode and the most advanced analog ICs through to high-end digital components such as memories and DSP.
Micross takes a design-led approach so let us know your electrical needs or pre-selected components to benchmark and we will work alongside you to make an assembly viable using bare die. Ultimately, our aim is to make your application as easy to support using bare die as it would be with packaged components.
Where a vendor may not usually be open to support a part in bare form, adding Micross' value-added wafer processing and die expertise to the supply chain can often make a real difference and unlock the possibility for support. This results in a winning situation for the vendor, value-added die distributor and the customer. As a result of this ongoing process in addition to the lines in our portfolio, we also stock and supply traceable, controlled and certified silicon die from other semiconductor vendors such as Intel, Infineon, Maxim, NXP, Cypress, Samsung, SST, Supertex and many more.
Aside from silicon, we also frequently handle other semiconductor materials in die form such as GaAs, SiC and SiGe. We work with GaAs and SiGe bare die products from well know RF specialists such as Macom, TriQuint, Hittite, Avago and many more. See our silicon carbide SiC bare die section to learn more.